Smart Sensor Integration

smart sensor module

Our expertise enables the seamless integration of smart sensors into our customized microelectronic modules, elevating the capabilities of our solutions across diverse industrial and commercial applications. Our team is adept at incorporating a sophisticated mix of components, ranging from bare-die devices to active and passive components.

End-to-End Microelectronic Development Expertise

miniaturized BGA on fingertip
electronics overmolding encapsulation
smart sensor module
System in package module
ic interposer replacement device

Ultra-dense, SWaP-optimized microelectronic assemblies. 

Survive harsh environments;
Temperature cycle, shock, and vibration.

Integration of sensors with microelectronic modules.

Multi-component modules in standard IC form factor
(BGA, QFP, etc.).

Replace obsolete ICs with a form/fit/function equivalent module.

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