Standard products and inventory are fabricated and qualified to ruggedization level 0. Select components on L0 products may be commercially-rated, suitable for use only in controlled, office/lab environments. PCBs within L0-rated products may not be conformally-coated. Convection cooling is assumed and heat-sinks compatible with mating Innovative products are available.
Products built to ruggedization levels 1 through 4 are processed as custom orders which are NCNR (non-cancellable, non-returnable), subject to mininum order quantities and a lot setup charge. All components on ruggedized products are suitably-rated to permit exposure to moisture, wider temperature ranges and higher levels of vibration/shock. PCBs within ruggedized products are conformally-coated. Conduction-cooling is mandatory and heat-spreaders compatible with mating Innovative products are available. Contact the Innovative sales department to obtain a quotation for any ruggedized product.
Most XMC and FMC modules and single board computers such as Cardsharp can be ruggedized to L4. However, qualification testing may be required, depending on the specific options required. Embedded PCs incorporating COM Exress modules such as ePC-nano, Mini-K7 and ePC-K7 can be ruggedized to L3. The ePC-Duo and all XMC adapter products except OpenVPX adapter 80260 are convection-cooled, thus restricted to L0.
Customers bear full responsibility for thermal, mechanical, firmware and software integration when mating with third-party hardware. Innovative can supply CAD mechanical models in a variety of formats to expedite integration. Innovative can provide custom design services to accelerate/augment integration efforts.